If you are building your own heatsinks, or having them built, one thing to remember is that there is a hard limit to the amount of heat a heatsink that uses heat pipes can dissipate.
It is somewhere between 30w and 35w per heat pipe run between the heat end and the cool end. Yours is using double ended heat pipes, so 12*30=360 is safe, 420 max. The limit has to do with the viscosity of the liquid in the heat pipes as it travels along the wick. Fatter heat pipes (with more volume and diameter), can move a bit more. Beyond that is water cooling.
I figured this is the last generation of cpus before air cooling wonāt work anymore. To make an air cooled dual 9684x was quite a challenge, and to make it work better than other systems was even more work.
I like the quiet and cool running, with a wolf in sheepās guise approach. However, so many steps had to be takenā¦.
Iāve spent an A to Z approach on this and Iām aware that this is my last 100: % air cooled build, the next build will prolly be a hybrid
Iāve built water cooled and some full immersion builds in the past but Iāve always liked the elegance of just air cooled.
For now, this one works really well, quiet, no throttling, no issues
Beyond the cooling, Iāve had to overcome BIOS Iissues (went through 3 betas, to get the 9684x sorted)
I do have one other work in progress on this board: I may heat pipe / revise heatsink for the gigabit lan chipā¦ it runs way hot (60-69C) from the factory with an ineffective cheesy aluminum coin of a heatsink. The issue is clarance ā¦. Work in progress
@JayVenturi, welcome to the forum. Iām envious of your skills! My bad luck with hardware means I probably wonāt achieve anything close to what youāve done. Still, you havenāt discouraged me from trying something similar to the system you showcased. Iām planning to go with a first-generation EPYC since itās the most affordable option. If I end up needing help to complete the build, at least I wonāt have spent too much.
So the gigabit lan chip with the aluminium flimsey heatsink was getting between 65-88C when BOTH Lan connections where on and 60-69C with on Lan connection
the original looked like this and the next thread will show how a copper dremmeled replacement was made and oxidized black
Final product was solid copper, shaved fins, reduced temps 22C on average.
Chip-side copper is polished copper, the other visible side is black, porous pitted to increase surface area.
Pitting was done using wheel brake cleaner (HCL) and vinigar to arrest the process, followed by the brass/copper black oxidizer
@Shadowbane Big fan of ThermalTake here. One thing you may have noticed about that case is that those boys certainly donāt scrimp on hardware. You get a whole lot for the money.
My main is the ThermalTake Level 10 GT. I like the hot swap bays that come with that unit and the fact that it is so roomy inside. I recently purchased a Thermaltake Versa H21 Mid Tower for a special project. Iām so glad that they still make cases with front bays as they are getting increasingly difficult to find.
my Epenis is so large I can slap elon musk into alpha centauri
Okay my joke asside
Air cooling has some components to it that can vary depending on what you want to achieve. Primarily do you or do you not care about dust chooses one of the first design parameters foe you. Positive or Negative Case Pressure. Maximum performance is yielded by negative case pressure but it attracts a ton of dust. Positive case pressure runs up against tbe caveat that you arent exhausting as fast as you possibly can BUT you will be pushing air out of the unfiltered cracks and air will be turbulent so dust shouldnt settle.
Since for me thats a givenā¦ Go positive air pressure easily.
My primary design parameter is noise. I loathe it. So I will prioritize bigger sizeā¦ Higher static pressure (radiators) or higher cfm (case fans that arent up against cages)ā¦ And more of the fansā¦ Instead of a few high power fans.