Ram Ranking Syntax

[Shader]

I’m looking at 2 pictures of Hynix ram and they have the exact same model number: HMA84GL7AMR4N-UH

One of them lists the ranking as 4DRx4 and the other lists as 4Rx4.

Does anyone know the difference between the 2 rankings? ChatGPT says the DR is for 3D chip stacking? Does that mean the 4DR has half the number of physical chips?

Does that have any performance difference?

[BobUltra]

Couldn’t that just be a typo?

Usually it’s 1R 2R 4R, single dual quad

[Shader]

nah I have pictures of 2 different chips

I’m surprised noone knows… how strange.

[BobUltra]

Asked Mistral’s LeChat Pro to solve the mystery, it found this:

Memory Rank 4DRx4 | AnandTech Forums: Technology, Hardware, Software, and Deals and this source RAM Ranks (1Rx4 vs 2Rx4 vs 4Rx4): Understanding Memory Module Configurations for Optimal Performance – Before The Trash Can

The “DR” is used by Samsung to indicate that dual-die packaged chips are used.

Which is weird, because it’s Hynix not Samsung here.

Aligns a bit with what I thought, depending on how big they are they may be dual like my 48GB modules are. But mine are Samsung

Full prompt output, by Mistra’l LeChat Pro:

The mystery of the RAM rankings “4DRx4” and “4Rx4” can be unraveled by understanding the terminology and technology behind these designations.

1. Ranking Basics:

• RAM ranks refer to the number of independent sets of DRAM chips that can be accessed simultaneously on a memory module. For example, a single-rank module has one set, a dual-rank has two, and a quad-rank has four sets.

2. 4Rx4 vs. 4DRx4:

• 4Rx4: This indicates a quad-rank module with a data width of 4 bits per DRAM chip. It means there are four ranks, each contributing to the total data width of the module.
• 4DRx4: The “DR” stands for “Dual-Die” or “Dual-Rank,” which means that each DRAM chip package contains two dies stacked together. This allows for higher density and capacity within the same physical space. Essentially, it means that the module has four ranks, but each rank is composed of dual-die chips, effectively doubling the capacity per chip package 12.

3. Performance Implications:

• The use of dual-die packages in 4DRx4 modules can lead to higher capacity modules without increasing the number of physical chips. This can be beneficial for high-density memory requirements, such as in server environments.
• However, the performance difference between 4Rx4 and 4DRx4 modules is generally minimal in terms of speed. The primary advantage of 4DRx4 is the increased capacity and potentially better efficiency in space and power consumption.

4. Compatibility:

• It’s important to ensure that your system supports the specific rank configuration of the RAM modules you intend to use. Some older systems or specific motherboards may have limitations on the number of ranks they can support, which could affect compatibility and stability 3.

In summary, the “DR” in 4DRx4 indicates the use of dual-die chip packages, which allows for higher capacity modules without changing the number of physical chips. This does not significantly affect performance but can be crucial for high-density memory requirements.

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Edit: Listening to buildzoid ramble on I picked up that non dual rank tend to be easier on the memory controller, though may have misunderstood him. So based on that if I had to choose I would go for the non D personally. Assuming they are priced equally.