Thanks for taking the time to evaluate our product! We’ve been eagerly awaiting this type of feedback and evaluation as it can dramatically influence our development in the near term.
Let me first assure folks on this thread that radiative cooling is not a gimmick - it is a very new and exciting technology under active development. The Wx-130 product represents a first attempt at commercialization of the technology (specifically, enhanced near-field thermal radiation) for an application we are passionate about - high performance computing. Bare with us as this is our first product release, and while we are thrilled to see it competing with some of the best pastes on the market, our aim is to exceed the capabilities of the best TIMs on the most power-dense CPUs/GPUs available and by much larger margins.
Next, let me point out an important issue raised here in testing thermal compounds. What is the figure of merit in this experiment? If it is a single data point for max temperature over ten minutes, I agree with your summary. If it is the average temps over the run, the list reverses and MX4 wins. If it is temperature relative to the power dissipated (e.g. ~thermal resistance), the data looks like this:
KPX: 77/240.3 = 0.3204 (3.7% better than Wx130)
TF7: 77/235.2 = 0.3274 (1.6% better than Wx130)
WX130: 74/222.4 = 0.3327
MX4: 73/206.6 = 0.3533 (-6.2% worse than Wx130)
This isn’t to be critical of the testing results - just trying to add some color to the discussion of a nuanced subject. It is interesting that the Wx-130 does reach a higher max temperature because that isn’t what we’d expect - and considering the temperatures involved and the materials utilized in the paste, there is likely some “burn-in” occurring still at ~80C (which is a good data point for us to have). Overall, your spread / mount and test setup look superb for all tests you ran - so nice job.
I would love to go into more detail on how the paste is “radiative” and why we are utilizing this mechanism of thermal transport as opposed to adding more and more highly thermally conductive fillers (which is how thermal paste has historically been developed) because the underlying physics of how radiation moves heat around is greatly underutilized (and has fascinating implications for the future). The technology to engineer the materials in the ways required to take full advantage of light in these settings has only recently become available (and yes AI + HPC simulation are critical tools for this!), but we are excited to see folks trying this first generation of Wx130 and humbly await more feedback from users like yourselves. I would implore folks to consider the average temperatures (so long as you’re not hitting thermal throttling events) and average power over benchmark runs, as well as the initial conditions (ambient temp, idle temp) from which the benchmark starts in the analysis.
This is all to say, we are sincerely grateful to you and the folks in this community for taking the time to learn about and evaluate our TIM. Rest assured, Wx130 is transporting heat across the interface differently than any other thermal compound does, and there is much more to come. We would love to send you another sample if you’re interested (DM us or reach out via email).
Thanks again for taking the time to evaluate - hopefully we can continue to engage with you all as we continue to develop and improve our products!