COMPUTEX 2018 news and hardware

would love to see raw aluminium cases inside and out , with silvery PCB and raw aluminium heat sinks. no RGB in sight possibly a clear light ( prefer no light) simple clean and not attention grabbing but effective for what is needed.

1 Like

Yeah, a bare metal look would be interesting.
Give that a well diffused warm white lightsource and no visible fans…
Basically make it look like hi-fi stuff.

1 Like

HOW DARE YOU?
Glass and RGB bullshit away :smiley:

1 Like
1 Like

Those are business class MBs for black boxes anyway…

I could get into this, just gimme cherry blues.

https://www.anandtech.com/show/12924/cooler-master-unveils-ck620-a-thin-wireless-mechanical-keyboard

PCBs and microprocessors aside, the cases from manufacturers that I’ve seen so far are truly uninspiring. Just the typical late 2010s “GLASS YOUR SIDES, MOAR CASE BODYKITS, FUCK YOU; NO MORE 3.5” INTERNAL AND 5.25" EXTERNAL DRIVE BAYS, SHOW OFF YOUR DAMN GPU WITH OUR DODGY PCIe EXTENDER AND RGB YOUR SHIT ALL OVER THE PLACE."

Missed the days when they went way too far for case utilisation. That said, some high end current cases though do have their built in hardware fan controllers, let alone the controller to control the RGB case disco lights.

Lol pretty funny how Steve is kinda wrong about those Asrock B450 Vrm designs.
Its an ISL pwm which means its probablly the ISL95712 or ISL95866 or similar,
which is a 4+3 phase pwm, but only comes with 2+1 intergrated gate drivers.
Which basiclly means that it its all the same “big” 3+3 phase again.
Since you cannot double from that pwm.

So its not a 6+3 phase atall, cause simplly no possiblé :wink:

1 Like

Oh, those might be something for me. I am still using apple aluminium keyboards because of the slightly larger keys. This is the first time something looks like a real alternative to that.

How odd, on mine (CM MasterKeys Pro L) the Windows key is the CM logo. Which I rather like. Subtle branding, and not the WIndows logo.

Yeah.
I’ve seen some gigabyte board, B450 with 6 phases… Can’t find the thing though…


Actually it’s 11 phases, so it looks like 6+5, my guess double 4 plus 3…

This looks like the best VRM on a B450 board so far. Some X370 have worse :smiley:

It even have WiFi… Damn…

1 Like

4+3 phases with doubled components on the Vcore rail looks possible.
I´m thinking about the possible pwm´s an their configuration combinations.
But my guess is that this board also using the ISL95712 or ISL95866 pwm which are 4+3 phase pwm’s.
But since those pwm’s only have a 2+1 intergrated gate drivers,
you cannot double the phases of this pwm.
So yeah probablly a big 4+3 phase design.

I cannot really think of anything else.
The Richtek pwm that MSi uses sometimes is 4+2 phase pwm.

And with IR pwm´s you cannot create 11 phases.
Also you wont see IR pwm´s on cheap B450 boards most likelly.

1 Like

Unless they cheap out like Asrock and use totally 6 phases… So Gigabyte can totally do 8+3…

They basiclly do the same thing as Asrock did pretty much.
Thats the onlly possible way i could think off.

Asrock basiclly “most likelly” using the ISL 4+3 phase pwm,
which includes 2+1 intergrated gate drivers.
So get those 3+3 phases, they have to use 1 additional driver for the vcore rail.
And 2 additional drivers on the soc rail.
That way you get a 3+3 phase design, then they just doubled up the components on each phase, to make it look like a 6+3 phase.
But in reallity its only a big 3+3 phase.

Gigabyte did the same thing on that board i guess.
But instead they added 2+2 external drivers.
That way they can fully utilize 4+3 phases from that pwm.
Then they doubled up the components on each phase from the vcore rail again.
So that way it looks like a 8+3 phase, but in reallity its just a big 4+3.

1 Like

HEY, I was reading that :smile:
Thank you

OK, since this isn’t really 2 phases, does that really help in any way?
I guess 2 things warm up now, so it helps thermal dissipation, but in power delivery, does this help at all?isn’t that just a waste of chips?

Yeah it definitelly helps to double up the components on each phase.
Its exally not a too bad solution, it will definitelly help with heat reduction.
It will not trully help in terms of reducing ripple current.

Way off topic, but recently I’ve been gaining more and more respect towards my motherboard. I mean I thought it was a silly move to just double the componentry, and now it turns out it actually helps in some aspects, so the VRM I have is actually OK… Also, I’ve been told that 70-80C on VRM is actually a fine temperature, so my board isn’t really overheating as I was fearing. So basically B350 Pro4 is pretty good for what it is - feature poor cheap board, that runs all Ryzen with some OK memory support.

1 Like

Well basiclly more true phases is generally better regulation wise,
and in terms of clean and flatter voltage output.
However The Asrock B350 pro4 in the 3+3 phase design is using SIno power SM4337 mosfets on the highside and SM4336 fets on the low side.
Which makes it capable in your particular configuration of about 156A ish,
i believe something arround that.
So its basiclly capable for a 1700 (X) and such,
if you have a decent airflow arround the vrm area.
Its not ideal but basiclly would work.

But a 2700X at 4.3GHz is probablly going to push it.

1 Like