I’ve designed a compact case for very high heat load water cooling (>1kW) while remaining quiet and I’d thought I’d share it here.
The case is mainly constructed of 14 gauge sheet metal with some 3d printed parts, a lathe for some of the hex extrusions would probably be beneficial but these could be 3d printed as well, with this in mind it should be fairly easy to produce yourself without specialized tools which was the pitfall I fell into with the last case design I posted here. Due to the amount of laser cutting time the panels require, sendcutsend doesn’t seem to be the most competitive place to order the panels from; I’m going to try fabworks, it’ll still be expensive when ordering single pieces instead of multiples, but its not far off from some of the higher end cases.
The model is 98% complete, there are a few things I didn’t bother modeling like screws, screw hole countersinks, foam intake filters and the power button (which is mostly 3d printed and sticks through one of the 140mm fan screw holes).
Feel free to critique anything you see on the case and I might change it before ordering (I’m probably going to order the sheet metal next week).
Basic specs:
- 18"x8.25"x17" (LxWxH)
- 25lbs empty
- x3 thick 140mm intake fans
- x2 dual 180mm fans+radiators
- SFX PSU only
- SSI-EEB and ATX motherboard compatibility
Interesting design points:
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The motherboard is elevated from the back by ~3/4" with fans behind it moving a lot of air so that the back side of the motherboard is cooled well.
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Since the radiators are crossflow, relatively little tubing is needed because the inlets and outlets are right next to the water blocks and pumps.
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Cable management is run from the bottom of the case to the top between the two radiators
Here’s the .STEP file for the case:
HPC Case.zip (10.4 MB)