A while back I saw an insane custom loop setup with a 9900K, but the setup was really under-performing relative to the amount cooling equipment. The bottleneck: transferring the heat energy from the relatively small hotspot on the IHS, through the waterblock, into the coolant.
I’m not an engineer, but that seemed like a really silly problem to have. So I came up with a concept to address those issues and designed it in Fusion 360. This really is just a concept, without manufacturability in mind.
Looking at the pictures and diagrams, what do you think? could this actually work? Like I said, not an engineer. If I knew how to set up and run a fluid/thermal physics simulation, I would.
Goal of the design:
- Spread heat from die across a much larger area
- Provide much much more surface area (without creating a low pressure zone)
Key differences to traditional water blocks:
- Use of a vapor chamber that is wrapped around a copper core
- Constricted capillary tubes instead of micro channels