There is absolutely no doubt that LM provides better transfer on a poorly finished interface, or that LM helps even with a properly finished interface.
This thread is asking for help to “Safely apply liquid metal”, and considering the number of people being informed to use LM that have little to no experience with it and do not understand the dangers should be informed that a comparable result can be had with lapping and some quality thermal paste.
- Lapping is mechanically far safer, the process occurs outside the laptop where there is no risk of getting metal particles inside the laptop causing shorts or damage.
- It is far cheaper, LM is stupid expensive for what little benefit it gives over lapping.
- A mistake in the lapping process simply messes up the heatsink which can be re-finished or replaced, a mistake with LM kills the entire laptop.
- LM remains a liquid and is very hard to inspect under the heatsink without special equipment. An excess application of LM may cause a bead to squeeze out the edge and a jolt of the portable laptop may dislodge the bead landing it somewhere it shouldn’t go.
- Reports of LM being involved in pitting the top of the CPU die, even if not directly the cause as mentioned above, such damage compromises the CPU in the long term.
- LM can not be removed without sanding/lapping surfaces, at which point you’re back to square one.
In short, LM is expensive, unsafe, irreversible without sanding & lapping, and can not be guaranteed to stay where it should. If you understand these risks and still wish to use it, sure, go ahead, but you have been warned.