Anyone have any news on whever haswell e will have the same thermal material as the old haswell or as the new one? (the Haswell line released last year, and the new line that will have improved thermal materials) Hoping so, maybe the high end processors will be on the same gen as the newest ones.
haswell-e is socket 2011-3 and isn't comparable to haswell. haswell refresh is the next after haswell. and haswell refresh should be better with thermals but i have a i7 4770k with an nh-d14 on 4.8ghz recently and it's fine. haswell-e is an complete different story.
I read somewhere that the Haswell refresh will solve some of the, ahem, less than desirable, ahem, thermal properties between the CPU cores and the heat-spreader (or lid, as in "delidding"). Basically they're saying that the thermal interface material is supposed to be upgraded and more consistently installed. I'll look for the article that I read that in and post it if I find it.
Heat increasers are useles for me. I always delid everything. I hate IHIs (integrated heat increases)!!! I have also never cracked a die.
I hope "updated packaging materials" means something like screws and hardware, Otherwise, this means "it is in a new box!", and that is a feature worth mentioning BEFORE "supported by new Intel 9 series chipset"
Technically Haswell-E will most likely have a soldered IHS like ivy bridge-e and sandy bridge-e, but I heard that the refresh will deal with the IHS being to high above the die to be useful, I don't think the TIM is going change (it might) but with Haswell (and possibly ivy bridge) the IHS itself was the issue