http://www.fujitsu.com/global/about/resources/news/press-releases/2015/0312-01.html
So we now have viable closed loop water/vapour cooling for phones and tables. Pretty cool (wow sorry did not even notice until I had typed it and read it back in my head). It is passive in that it does not have a pump but drives itself through capillary action.
They plan to bring it to market in 2017.
Fujitsu will develop design and cost-saving technologies for mobile devices equipped with the thin loop heat pipe, with the aim of introducing a practical implementation during fiscal 2017
I already OC my phone so this could get interesting.
Addition: I wonder if this is susceptible to damage for drops as it is very thin and still copper so bending might be an issue in the real world. Also the vapour chamber uses four 0.1 mm thick mesh plates and two outer plates for six surfaces so could be easily damaged maybe?
And now they are able to thin it down i wonder if it scales up to larger components, could this apply to PC in the future and make existing loop designs more efficient?