I just build my first fully custom loop in my scratch built case and I am having a strange issue. The system is complex and large but I will attempt to describe it as simply as possible. 3x DDC 1+s with a XSPC top ---> 480mm rad ---> 180x3 rad ---> 480 rad ---> 480 rad ---> Mobo VRM block ---> CPU block ---> 140mm rad ---> GPU blocks ---> res ---> back to pumps What has happened is that the system cannot be sealed without insane, dangerous, and insanely dangerous pressures building up and breaking fittings loose. I don't really want to leave my res top open forever. If anyone has any ideas as to why this thing won't behave I would greatly appreciate them! The thought occurred that you like pictures and I need help, fair trade!
Hi easiest way would be using pressure equailization membrane on a top of the res.There are some and they help with pressure buildup.
When water gets heated hup, the dissolved air in liquid is released as the solubility of air in water drops with the rise of temperature, released gas increases the pressure in the loop further. http://www.engineeringtoolbox.com/air-solubility-water-d_639.html .also did you try to space out pumps ? i mean 2xrad then pump , another 2 components, pump etc. Also using 3 pumps might lead to that.You would need a flow meters to find the balance betwin flow and pressure.If the above doesnt help try using only 2 pumps and see if it works
I think I will order a pressure equalization membrane and in the meantime i will try it with one less pump and see if that solves the problem, thanks for the hydro-static engineering link it was very helpful in explaining why my system overflows once the pumps turn off!
