I’d expect them to have at least two, maybe three different I/O chip designs going forward: One for EPYC (8 ch RAM + 128 PCIe-lanes), one for regular Ryzen (2ch RAM + 24 PCIe lanes), and maybe one for Threadripper (unless they repurpose faulty EPYC ones for those - seeing as the volumes are much lower).
What about APUs? Will they also feature a separate CPU chip and a separate GPU chip? If so, it would allow AMD to create more combinations, some with bigger GPUs - especially now that there’s available power budget. I could even see a combined L4 cache/video memory HBM stack.
If CPU and GPU will be on the same die, will the I/O also be integrated for APUs - the packages would need to route video separately anyways, so does a separate I/O chip bring any cost savings?
This change to more modularity could also allow AMD to potentially offer the full 24 PCIe lanes on APUs (unless the PCIe pins are reused for video, not sure about that).